Material card creation LT (low temperature up to -40 °C)

"- Determination of density - Tensile testing at multiple speeds / strain rates - Bending tests at multiple speeds / strain rates - Material map creation (CAE) for all FEM solvers e.g.: Abaqus, Ansys, LS Dyna, Pam Crash, Nastran, Radioss and others - Optional production of panels made of granulate by injection molding - Optional extensions with compression tests, shear tests, notched tensile tests, cupping tests or component tests possible This option is intended to examine the mechanical behavior of the material under low temperatures and to create a predictive material map for the stiffness/strength/crash calculation in the respective solver. With the help of tensile tests at different pull-off speeds on a tensile testing machine, an experimental database on the deformation and failure behavior of the plastic is created. The aim is to determine force-displacement curves as well as true stress-strain curves. Some materials show a strongly localized deformation behavior before failure. This must be taken into account when selecting the strain measurement method. Therefore, in addition to the evaluation of global force-distance curves, an optical strain measurement method is also used here. The local strains at any point on the sample can be determined with high temporal and spatial resolution. Furthermore, 3-point bending tests are carried out, which enable the material map to be adjusted under a multi-axial stress state. Based on the results, a suitable material model is selected in consultation with the customer. After defining the material map, the tests are re-simulated with a defined element edge length and the determined input parameters are verified and, if necessary, optimized by comparing the global force-displacement curves. Project result: - Documentation for the correlation of test vs. simulation results - Test report of the test results - tested samples - Stress-strain curves (true values) of the individual tests - 1 static and 1 dynamic material card per material at low temperature"